W25Q32BV_13 Datasheet, PDF (4/78 Pages) Winbond – 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

W25Q32BV
7.2.37
7.2.38
7.2.39
Erase Security Registers (44h)...........................................................................................58
Program Security Registers (42h) ......................................................................................59
Read Security Registers (48h) ...........................................................................................60
8. ELECTRICAL CHARACTERISTICS .............................................................................................. 61
8.1 Absolute Maximum Ratings ⁽¹⁾⁽²⁾ ................................................................................... 61
8.2 Operating Ranges .............................................................................................................. 61
8.3 Power-Up Power-Down Timing and Requirements(1 ........................................................ 62
8.4 DC Electrical Characteristics.............................................................................................. 63
8.5 AC Measurement Conditions ............................................................................................. 64
8.6 AC Electrical Characteristics .............................................................................................. 65
8.7 AC Electrical Characteristics (cont’d) ................................................................................. 66
8.8 Serial Output Timing........................................................................................................... 67
8.9 Serial Input Timing.............................................................................................................. 67
8.10 HOLD Timing...................................................................................................................... 67
8.11 WP Timing .......................................................................................................................... 67
9. PACKAGE SPECIFICATION .......................................................................................................... 68
9.1 8-Pin SOIC 208-mil (Package Code SS) ........................................................................... 68
9.2 8-Pin VSOP 208-mil (Package Code ST) .......................................................................... 69
9.3 8-Pin PDIP 300-mil (Package Code DA)............................................................................ 70
9.4 8-Pad WSON 6x5-mm (Package Code ZP)....................................................................... 71
9.5 8-Pad WSON 8x6-mm (Package Code ZE)....................................................................... 72
9.6 16-Pin SOIC 300-mil (Package Code SF).......................................................................... 73
9.7 24-Ball TFBGA 8x6-mm (Package Code TB, 5x5-1 ball array) ......................................... 74
9.8 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array) ............................................ 75
10. ORDERING INFORMATION .......................................................................................................... 76
10.1 Valid Part Numbers and Top Side Marking ........................................................................ 77
11. REVISION HISTORY...................................................................................................................... 78
-4-