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W83759A Datasheet, PDF (41/41 Pages) Winbond – ADVANCED VL-IDE DISK CONTROLLER
PACKAGE DIMENSION
100-pin QFP
100
1
HD
D
81
80
E HE
30
51
31
e
b
50
Seating PlaneSee Detail F
A2 A
A1
y
c
L
L1
Detail F
W83759A
Symbol
Dimension in inches Dimension in mm
Min. Nom Max. Min. Nom Max.
A
0.130
3.30
A1
0.004
0.10
A2
0.107 0.112 0.117 2.73 2.85 2.97
b
0.010 0.012 0.016 0.25 0.30 0.40
c
0.004 0.006 0.010 0.10 0.15 0.25
D
0.546 0.551 0.556 13.87 14.00 14.13
E
0.782 0.787 0.792 19.87 20.00 20.13
e
0.020 0.026 0.032 0.50 0.65 0.80
HD
0.728 0.740 0.752 18.49 18.80 19.10
HE
0.964 0.976 0.988 24.49 24.80 25.10
L
0.039 0.047 0.055 1.00 1.20 1.40
L1
0.087 0.094 0.103 2.21 2.40 2.62
y
0.004
0.10
0
0
12
0
12
Notes:
1. Dimension D & E do not include interlead
flash.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Controlling dimension: Millimeters
4. General appearance spec. should be based on final
visual inspection spec.
Headquarters
Winbond Electronics (H.K.) Ltd.
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5792646
Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: 852-27516023
FAX: 852-27552064
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-7197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: 886-2-7190505
FAX: 886-2-7197502
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2730 Orchard Parkway, San Jose,
CA 95134, U.S.A.
TEL: 1-408-9436666
FAX: 1-408-9436668
Note: All data and specifications are subject to change without notice.
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Publication Release Date: May 1995
Revision A1