W29GL256PL9T-TR Datasheet, PDF (3/64 Pages) Winbond – 256M-BIT 3.0-VOLT PARALLEL FLASH MEMORY WITH PAGE MODE

W29GL256P
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ELECTRICAL CHARACTERISTICS ......................................................................................... 30
8.1 Absolute Maximum Stress Ratings ............................................................................... 30
8.2 Operating Temperature and Voltage ............................................................................ 30
8.3 DC Characteristics ........................................................................................................ 31
8.4 Switching Test Circuits.................................................................................................. 32
8.4.1 Switching Test Waveform ............................................................................................... 32
8.5 AC Characteristics ........................................................................................................ 33
8.5.1 Instruction Write Operation ............................................................................................. 34
8.5.2 Read / Reset Operation .................................................................................................. 35
8.5.3 Erase/Program Operation ............................................................................................... 37
8.5.4 Write Operation Status....................................................................................................46
8.5.5 WORD/BYTE CONFIGURATION (#BYTE)..................................................................... 50
8.5.6 DEEP POWER DOWN MODE........................................................................................52
8.5.7 WRITE BUFFER PROGRAM..........................................................................................52
8.6 Recommended Operating Conditions........................................................................... 53
8.6.1 At Device Power-up ........................................................................................................ 53
8.7 Erase and Programming Performance ......................................................................... 54
8.8 Data Retention .............................................................................................................. 54
8.9 Latch-up Characteristics ............................................................................................... 54
8.10 Pin Capacitance............................................................................................................ 54
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PACKAGE DIMENSIONS ......................................................................................................... 55
9.1 TSOP 56-pin 14x20mm ................................................................................................ 55
9.2 Low-Profile Fine-Pitch Ball Grid Array, 64-ball 11x13mm (LFBA64) ............................ 56
10 ORDERING INFORMATION..................................................................................................... 57
10.1 Ordering Part Number Definitions................................................................................. 57
10.2 Valid Part Numbers and Top Side Marking .................................................................. 58
11 HISTORY .................................................................................................................................. 59
Publication Release Date: Jul 02, 2014
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Revision A