W83176R-732_06 Datasheet, PDF (10/12 Pages) Winbond – 2 DIMM DDR ZERO DELAY buffer for Sis chipset

W83176R-732/W83176G-732
2 DIMM DDR ZERO DELAY buffer for Sis chipset
9. ORDERING INFORMATION
Part Number
W83176R-732
W83176G-732
Package Type
28 PIN SSOP
28 PIN SSOP
(Lead free package)
Production Flow
Commercial, 0°C to +70°C
Commercial, 0°C to +70°C
10. HOW TO READ THE TOP MARKING
W83176R-732
28051234
442GB
W83176G-732
28051234
442GB
1st line: Winbond logo and the type number:
Normal package: W83176R-732, Lead free package:W83176G-732
2nd line: Tracking code 2 8051234
2: wafers manufactured in Winbond FAB 2
8051234: wafer production series lot number
3rd line: Tracking code 342 G B
442: packages made in '2003, week 42
G: assembly house ID; O means OSE, G means GR
B: IC revision
All the trade marks of products and companies mentioned in this data sheet belong to their
respective owners.
-7-
Publication Release Date: March, 2006
Revision 1.1