W3E32M64S-XBX Datasheet, PDF (16/17 Pages) White Electronic Designs Corporation – 32Mx64 DDR SDRAM

White Electronic Designs
W3E32M64S-XBX
PACKAGE DIMENSION: 219 PLASTIC BALL GRID ARRAY (PBGA)
Bottom View
19.05 (0.750)
NOM
1.27 (0.050)
NOM
25.1 (0.988) MAX
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
219 x ∅ 0.762 (0.030) NOM
19.05 (0.750) NOM
Note: This package utlizes solderballs which contain lead: Sn63Pb37
If you require lead free solder ball packages, please contack WEDC for information
25.1 (0.988)
MAX
2.03 (0.080)
MAX
0.61
(0.024)
NOM
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
ORDERING INFORMATION
W 3E 32M 64 S - XXX B X
WHITE ELECTRONIC DESIGNS CORP.
DDR SDRAM
CONFIGURATION, 32M x 64
2.5V Power Supply
DATA RATE (Mbs):
200 = 100MHz/200Mbs
250 = 125MHz/250Mbs
266 = 133MHz/266Mbs
333 = 166MHz/333Mbs
PACKAGE:
B = 219 Plastic Ball Grid Array (PBGA), 25mm x 25mm
DEVICE GRADE:
M = Military
I = Industrial
C = Commercial
-55°C to +125°C
-40°C to +85°C
0°C to +70°C
July 2006
Rev. 3
16
White Electronic Designs Corporation • [phone] • www.wedc.com