SI8416DB Datasheet, PDF (8/9 Pages) Vishay Siliconix – N-Channel 8 V (D-S) MOSFET

Si8416DB
Vishay Siliconix
PACKAGE OUTLINE
MICRO FOOT: 6-BUMP (0.5 mm PITCH)
A
1
6 x Ø 0.24 to 0.26 Note 3
Solder Mask ~ Ø 0.25
B
C
2
e
e
Bump Note 2
Recommended Land
6xØb
8416
XXX
D
S
S
D
S
G
Mark on Backside of Die
s
e
e
s
E
Notes (unless otherwise specified):
1. All dimensions are in millimeters.
2. Six (6) solder bumps are lead (Pb)-free 95.5Sn, 3.8Ag, 0.7Cu with diameter ∅ 0.30 mm to 0.32 mm.
3. Backside surface is coated with a Ti/Ni/Ag layer.
4. Non-solder mask defined copper landing pad.
·5. is location of pin 1.
Dim.
A
A₁
A₂
b
e
s
D
E
Min.
0.510
0.220
0.290
0.300
0.230
0.920
1.420
Millimeters^a
Nom.
0.575
0.250
0.300
0.310
0.500
0.250
0.960
1.460
Note:
a. Use millimeters as the primary measurement.
Max.
0.590
0.280
0.310
0.320
0.270
1.000
1.500
Min.
0.0201
0.0087
0.0114
0.0118
0.0090
0.0362
0.0559
Inches
Nom.
0.0224
0.0098
0.0118
0.0122
0.0197
0.0098
0.0378
0.0575
Max.
0.0232
0.0110
0.0122
0.0126
0.0106
0.0394
0.0591
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?63716.
www.vishay.com
Document Number: 63716
8
S11-2526-Rev. A, 26-Dec-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000