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SI8416DB Datasheet, PDF (1/9 Pages) Vishay Siliconix – N-Channel 8 V (D-S) MOSFET
N-Channel 8 V (D-S) MOSFET
Si8416DB
Vishay Siliconix
PRODUCT SUMMARY
VDS (V)
RDS(on) (Ω) Max.
0.023 at VGS = 4.5 V
0.025 at VGS = 2.5 V
8
0.030 at VGS = 1.8 V
0.040 at VGS = 1.5 V
0.095 at VGS = 1.2 V
ID (A)d
16
16
16
15
3
Qg (Typ.)
17 nC
MICRO FOOT
Bump Side View
Backside View
S
G
2
1
S
S
3
6
FEATURES
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET® Power MOSFET
• Ultra-small 1.5 mm x 1 mm Maximum Outline
• Ultra-thin 0.59 mm Maximum Height
• Compliant to RoHS Directive 2002/95/EC
APPLICATIONS
• Low On-Resistance Load Switch for Portable Devices
- Low Power Consumption, Low Voltage Drop
- Increased Battery Life
- Space Savings on PCB
D
D
D
4
5
Device Marking: 8416
xxx = Date/Lot Traceability Code
Ordering Information:
Si8416DB-T2-E1 (Lead (Pb)-free and Halogen-free)
G
N-Channel MOSFET
S
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
Gate-Source Voltage
VDS
8
V
VGS
±5
TC = 25 °C
16e
Continuous Drain Current (TJ = 150 °C)
TC = 70 °C
TA = 25 °C
ID
16e
9.3a, b
TA = 70 °C
7.4a, b
A
Pulsed Drain Current (t = 300 µs)
IDM
20
Continuous Source-Drain Diode Current
TC = 25 °C
TA = 25 °C
IS
11
2.3a, b
Maximum Power Dissipation
TC = 25 °C
13
TC = 70 °C
TA = 25 °C
PD
8.4
2.77a, b
W
TA = 70 °C
1.77a, b
Operating Junction and Storage Temperature Range
TJ, Tstg
- 55 to 150
°C
Package Reflow Conditionsc
IR/Convection
260
Notes:
a. Surface mounted on 1" x 1" FR4 board.
b. t = 10 s.
c. Refer to IPC/JEDEC (J-STD-020), no manual or hand soldering.
d. Case in defined as the top surface of the package.
e. TC = 25 °C package limited.
Document Number: 63716
www.vishay.com
S11-2526-Rev. A, 26-Dec-11
1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000