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SUP60N10-18P Datasheet, PDF (2/7 Pages) Vishay Siliconix – N-Channel 100-V (D-S) MOSFET
SUP60N10-18P
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
Drain-Source On-State Resistancea
Forward Transconductancea
Dynamicb
VDS
VGS(th)
IGSS
IDSS
ID(on)
RDS(on)
gfs
VDS = 0 V, ID = 250 µA
VDS = VGS, ID = 250 µA
VDS = 0 V, VGS = ± 20 V
VDS = 100 V, VGS = 0 V
VDS = 100 V, VGS = 0 V, TJ = 125 °C
VDS = 100 V, VGS = 0 V, TJ = 175 °C
VDS ≥ 10 V, VGS = 10 V
VGS = 10 V, ID = 15 A
VGS = 10 V, ID = 15 A, TJ = 125 °C
VGS = 8.0 V, ID = 10 A
VDS = 15 V, ID = 15 A
Input Capacitance
Ciss
Output Capacitance
Coss
VGS = 0 V, VDS = 50 V, f = 1 MHz
Reverse Transfer Capacitance
Crss
Total Gate Chargec
Qg
Gate-Source Chargec
Qgs
VDS = 50 V, VGS = 10 V, ID = 50 A
Gate-Drain Chargec
Qgd
Gate Resistance
Rg
f = 1 MHz
Turn-On Delay Timec
td(on)
Rise Timec
Turn-Off Delay Timec
tr
td(off)
VDD = 50 V, RL = 1.0 Ω
ID ≅ 50 A, VGEN = 10 V, Rg = 1 Ω
Fall Timec
tf
Drain-Source Body Diode Characteristics TC = 25 °Cb
Continuous Current
IS
Pulsed Current
ISM
Forward Voltagea
VSD
IF = 15 A, VGS = 0 V
Reverse Recovery Time
trr
Peak Reverse Recovery Current
IRM(REC)
IF = 50 A, dI/dt = 100 A/µs
Reverse Recovery Charge
Qrr
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
c. Independent of operating temperature.
Min.
100
2.5
50
0.25
Typ.
Max.
Unit
V
4.5
± 250
nA
1
50
µA
250
A
0.015 0.0183
0.027
0.033
Ω
0.018
0.023
33
S
2600
230
pF
80
48
75
16
nC
13
1.1
2.4
Ω
12
20
10
20
ns
18
35
8
15
60
A
100
0.85
1.5
V
80
120
ns
4
A
160
240
nC
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 65003
S09-1096-Rev. A, 15-Jun-09