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SI4823DY Datasheet, PDF (2/12 Pages) Vishay Siliconix – P-Channel 20 V (D-S) MOSFET with Schottky Diode
Si4823DY
Vishay Siliconix
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient (MOSFET)b, e
Maximum Junction-to-Foot (Drain) (MOSFET)
Maximum Junction-to-Ambient (Schottky)b, f
Maximum Junction-to-Foot (Drain) (Schottky)
Notes:
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Based on TC = 25 °C.
e. Maximum under steady state conditions is 110 °C/W.
f. Maximum under steady state conditions is 115 °C/W.
Symbol
RthJA
RthJF
RthJA
RthJF
Typical
60
35
63
39
Maximum
71.5
45
78
47
Unit
°C/W
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Static
Drain-Source Breakdown Voltage
VDS Temperature Coefficient
VGS(th) Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Currenta
Drain-Source On-State Resistancea
Forward Transconductancea
Dynamicb
VDS
ΔVDS/TJ
ΔVGS(th)/TJ
VGS(th)
IGSS
IDSS
ID(on)
RDS(on)
gfs
VGS = 0 V, ID = - 250 µA
ID = - 250 µA
VDS = VGS, ID = - 250 µA
VDS = 0 V, VGS = ± 12 V
VDS = - 20 V, VGS = 0 V
VDS = - 20 V, VGS = 0 V, TJ = 55 °C
VDS ≤ 5 V, VGS = - 4.5 V
VGS = - 4.5 V, ID = - 3.3 A
VGS = - 2.5 V, ID = - 2.6 A
VDS = - 10 V, ID = - 3.3 A
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Ciss
Coss
Crss
Qg
VDS = - 10 V, VGS = 0 V, f = 1 MHz
VDS = - 10 V, VGS = - 10 V, ID = - 3.3 A
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off DelayTime
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off DelayTime
Fall Time
Drain-Source Body Diode Characteristics
Qgs
Qgd
Rg
td(on)
tr
td(off)
tf
td(on)
tr
td(off)
tf
Continuous Source-Drain Diode Current
IS
Pulse Diode Forward Current
ISM
Body Diode Voltage
VSD
Body Diode Reverse Recovery Time
trr
Body Diode Reverse Recovery Charge
Qrr
Reverse Recovery Fall Time
ta
Reverse Recovery Rise Time
tb
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
VDS = - 10 V, VGS = - 4.5 V, ID = - 3.3 A
f = 1 MHz
VDD = - 10 V, RL = 3.8 Ω
ID ≅ - 2.6 A, VGEN = - 10 V, Rg = 1 Ω
VDD = - 10 V, RL = 3.8 Ω
ID ≅ - 2.6 A, VGEN = - 4.5 V, Rg = 1 Ω
TC = 25 °C
IS = - 2.6 A, VGS = 0 V
IF = - 2.6 A, dI/dt = 100 A/µs, TJ = 25 °C
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2
Min.
- 20
- 0.6
- 15
1.2
Typ. Max. Unit
- 20
3
0.090
0.140
6
- 1.5
± 100
-1
- 10
0.108
0.175
V
mV/°C
V
nA
µA
A
Ω
S
330
660
80
160
pF
57
114
8
12
4
6
nC
0.8
1.4
6
12
Ω
3
6
10
20
16
24
8
15
ns
18
27
40
60
18
27
10
15
- 6.2
A
- 15
- 0.8 - 1.2
V
23
35
ns
14
21
nC
11
ns
12
Document Number: 64715
S10-1051-Rev. C, 03-May-10