SIA477EDJT Datasheet, PDF (1/8 Pages) Vishay Siliconix – P-Channel 12 V (D-S) MOSFET

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SiA477EDJT
Vishay Siliconix
P-Channel 12 V (D-S) MOSFET
Thin PowerPAK^® SC-70-6L Single
D
D6
S5
4
0.6 mm
1 _2.05 ^mm
Top View
PRODUCT SUMMARY
V_DS (V)
R_DS(on) max. () at V_GS = -4,5 V
R_DS(on) max. () at V_GS = -3.7 V
R_DS(on) max. () at V_GS = -2.5 V
R_DS(on) max. () at V_GS = -1.8 V
Q_g typ. (nC)
I_D (A)
Configuration
S
1
7
2D
3D
G
Bottom View
-12
0.0130
0.0145
0.0190
0.0320
33
-12
Single
FEATURES
• TrenchFET^® Gen III p-channel power MOSFET
• Thermally enhanced PowerPAK^® SC-70 package
- Small footprint area
- Low on-resistance
• 100 % R_g tested
• R_DS(on) rating at V_GS = -1.8 V
• Built in ESD protection with Zener diode
• Typical ESD performance: 3500 V
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
S
• Smart phones, tablet PCs, mobile
computing 
- Battery switch
- Charger switch
G
- Load switch
P-Channel MOSFET
D
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
Thin PowerPAK SC-70-6L
SiA477EDJT-T1-GE3
ABSOLUTE MAXIMUM RATINGS (T_A = 25 °C, unless otherwise noted)
PARAMETER
SYMBOL
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (T_J = 150 °C)
Pulsed Drain Current (t = 100 μs)
Continuous Source-Drain Diode Current
Maximum Power Dissipation
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak temperature) ^{d, e}
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
T_C = 25 °C
T_A = 25 °C
T_C = 25 °C
T_C = 70 °C
T_A = 25 °C
T_A = 70 °C
V_DS
V_GS
I_D
I_DM
I_S
P_D
T_J, T_stg
LIMIT
-12
±8
-12 ^a
-12 ^a
-12 ^{a, b, c}
-11 ^{b, c}
-50
-12 ^a
-2.9 ^{b, c}
19
12
3.5 ^{b, c}
2.2 ^{b, c}
-55 to +150
260
UNIT
V
A
W
°C
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
TYPICAL
MAXIMUM
UNIT
Maximum Junction-to-Ambient ^{b, f}
Maximum Junction-to-Case (Drain)
t5s
R_thJA
28
Steady state
R_thJC
5.3
36
°C/W
6.5
Notes
a. Package limited.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 5 s.
d. See solder profile (www.vishay.com/doc?73257). The PowerPAK SC-70 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 80 °C/W.
S16-1724-Rev. A, 29-Aug-16
1
Document Number: 77703
For technical questions, contact: [e-mail]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000