TGS2354_15 Datasheet, PDF (9/11 Pages) TriQuint Semiconductor – 0.5-6.0 GHz 40 Watt GaN Switch

TGS2354
0.5-6.0 GHz 40 Watt GaN Switch
Mechanical Drawing & Bond Pad Description
Unit: millimeters
Thickness: 0.10
Die x, y size tolerance: +/- 0.050
Chip edge to bond pad dimensions are shown to center of pad
Ground is backside of die
Bond Pad Symbol Description
1
RFC RF common port; matched to 50 Ω; DC coupled
2, 7
VC1 Control voltage 1
3, 6
VC2 Control voltage 2
4
RF1 RF switched port 1; matched to 50 Ω; DC coupled
5
RF2 RF switched port 2; matched to 50 Ω; DC coupled
Datasheet: Rev - 07-23-14
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