TGS2354_15 Datasheet, PDF (8/11 Pages) TriQuint Semiconductor – 0.5-6.0 GHz 40 Watt GaN Switch

Evaluation Board
RF Layer is 0.010” thick Rogers Corp. RO4350B, εr = 3.48.
Metal layers are 0.5 oz. copper. The microstrip line at the
connector interface is optimized for the Southwest
Microwave end launch connector 1092-02A-5.
The pad pattern shown has been developed and tested for
optimized assembly at TriQuint Semiconductor. The PCB
land pattern has been developed to accommodate lead
and package tolerances. Since surface mount processes
vary from company to company, careful process
development is recommended.
TGS2354
0.5-6.0 GHz 40 Watt GaN Switch
Mounting Detail
Note: MMIC die is mounted directly to carrier plate in the cutout of the EVB.
Datasheet: Rev - 07-23-14
© 2014 TriQuint
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Disclaimer: Subject to change without notice
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