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TGS2353_15 Datasheet, PDF (9/10 Pages) TriQuint Semiconductor – DC – 18 GHz High Power SPDT Switch | |||
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TGS2353
DC â 18 GHz High Power SPDT Switch
Product Compliance Information
ESD Information
ESD Rating:
Value:
Test:
Standard:
TBD
Passes ⥠TBD V min.
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ECCN
US Department of Commerce EAR99
Solderability
This part is compliant with EU 2002/95/EC RoHS
directive (Restrictions on the Use of Certain Hazardous
Substances in Electrical and Electronic Equipment).
This product also has the following attributes:
⢠Lead Free
⢠Halogen Free (Chlorine, Bromine)
⢠Antimony Free
⢠TBBP-A (C15H12Br402) Free
⢠PFOS Free
⢠SVHC Free
Assembly Notes
Component placement and adhesive attachment assembly notes:
⢠Vacuum pencils and/or vacuum collets are the preferred method of pick up.
⢠Air bridges must be avoided during placement.
⢠The force impact is critical during auto placement.
⢠Organic attachment (i.e. epoxy) can be used in low-power applications.
⢠Curing should be done in a convection oven; proper exhaust is a safety concern.
Reflow process assembly notes:
⢠Use AuSn (80/20) solder and limit exposure to temperatures above 300°C to 3-4 minutes, maximum.
⢠An alloy station or conveyor furnace with reducing atmosphere should be used.
⢠Do not use any kind of flux.
⢠Coefficient of thermal expansion matching is critical for long-term reliability.
⢠Devices must be stored in a dry nitrogen atmosphere.
Interconnect process assembly notes:
⢠Thermosonic ball bonding is the preferred interconnect technique.
⢠Force, time, and ultrasonics are critical parameters.
⢠Aluminum wire should not be used.
⢠Devices with small pad sizes should be bonded with 0.0007-inch wire.
Preliminary Data Sheet: Rev A 06/20/11
© 2011 TriQuint Semiconductor, Inc.
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Disclaimer: Subject to change without notice
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