TGS2353_15 Datasheet, PDF (8/10 Pages) TriQuint Semiconductor – DC – 18 GHz High Power SPDT Switch

TGS2353
DC – 18 GHz High Power SPDT Switch
Mechanical Information
0.175 0.300
0.925 0.985
1.652
1.476
23
4
1.476
1.275
1.031
0.826
1
0.621
0.177
76
0.0
0.377
5
0.177
0.0 0.175 0.300
0.925 1.150
Unit: millimeters
Thickness: 0.10
Die x, y size tolerance: +/- 0.050
Chip edge to bond pad dimensions are shown to center of pad
Ground is backside of die
Bond Pad
1
2, 7
3, 6
4
5
Symbol
RF In
Vc2
Vc1
RF Out1
RF Out2
Pad Size
0.100 x 0.200
0.100 x 0.100
0.100 x 0.100
0.200 x 0.100
0.200 x 0.100
Preliminary Data Sheet: Rev A 06/20/11
© 2011 TriQuint Semiconductor, Inc.
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Disclaimer: Subject to change without notice
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