MAX11311 Datasheet, PDF (3/51 Pages) Maxim Integrated Products – PIXI, 12-Port Programmable Mixed-Signal I/O with 12-Bit ADC, 12-Bit DAC, Analog Switches, and GPIO

MAX11311
PIXI, 12-Port Programmable Mixed-Signal I/O with
12-Bit ADC, 12-Bit DAC, Analog Switches, and GPIO
Absolute Maximum Ratings
DVDD to DGND........................................................-0.3V to +6V
AVDD to AGND........................................................-0.3V to +6V
AVDDIO to AVSSIO................................................-0.3V to +25V
AVDDIO to AGND...................................................-0.3V to +17V
AVSSIO to AGND...................................................-14V to +0.3V
AGND to AGND1...................................................-0.3V to +0.3V
AGND to DGND....................................................-0.3V to +0.3V
AGND1 to DGND..................................................-0.3V to +0.3V
(PORT0 to PORT11) to AGND..............max of (V_AVSSIO - 0.3V)
or -14V to min of (V_AVDDIO + 0.3V) or +17V
(PORT0 to PORT11) to AGND (GPI and Bidirectional Level
Translator Modes)...... -0.3V to the min of (V_AVDD + 0.3V) or +6V
(CNVT, DOUT) to DGND.... -0.3V to the min of (V_DVDD + 0.3V)
or +6V
(CS, SCLK, DIN, INT) to DGND...............................-0.3V to +6V
DAC and ADC Reference Pins to AGND (DAC_REF,
ADC_INT_REF).......................................... -0.3V to the min of
Temperature Sensor Pins
(V_AVDD + 0.3V) or +4V
(D0N, D0P, D1N, D1P) to AGND..................... -0.3V to the min of
(V_AVDD + 0.3V) or +6V
Current into Any PORT Pin...............................................100mA
Current into Any Other Pin Except Supplies
and Ground.....................................................................50mA
Continuous Power Dissipation (T_A = +70°C) (Multilayer board)
TQFN (derate 34.5mW/°C above +70°C) ..............2758.6mW
Operating Temperature Range.......................... -40°C to +105°C
Storage Temperature Range............................. -65°C to +150°C
Lead Temperature (soldering, 10s).................................. +300°C
Soldering Temperature (reflow)........................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Thermal Characteristics (Note 1)
TQFN
Junction-to-Case Thermal Resistance (θ_JC)...............1.7°C/W
Junction-to-Ambient Thermal Resistance (θ_JA)...........29°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Electrical Characteristics
ADC Electrical Specifications
(V_AVDD = 4.75V to 5.25V, V_DVDD = 3.3V, V_AVDDIO = +12.0V, V_AGND = V_DGND = 0V, V_AVSSIO = -2.0V, V_DACREF = 2.5V, V_ADCREF = 2.5V
(Internal), f_S = 400ksps, 10V analog input range set to range 1 (0 to +10V). T_A = -40°C to +105°C, unless otherwise noted. Typical values
are at T_A = +25°C.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
DC ACCURACY (Note 3)
Resolution
12
Bits
Integral Nonlinearity
INL
±2.5
LSB
Differential Nonlinearity
DNL No missing codes over temperature
±1
LSB
Offset Error
±0.5
±8
LSB
Offset Error Drift
±0.002
LSB/ºC
Gain Error
±11
LSB
Gain Error Drift
±0.01
LSB/ºC
Channel-to-Channel Offset
Matching
1
LSB
Channel-to-Channel Gain
Matching
2
LSB
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