MSP430FR5739-EP_16 Datasheet, PDF (87/95 Pages) Texas Instruments – Mixed-Signal Microcontrollers

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MSP430FR5739-EP
SLVSCN6A – NOVEMBER 2014 – REVISED DECEMBER 2014
SLAZ386
SLAZ385
SLAZ384
SLAZ383
specifications for each silicon revision of this device.
MSP430FR5733 Device Erratasheet. Describes the known exceptions to the functional
specifications for each silicon revision of this device.
MSP430FR5732 Device Erratasheet. Describes the known exceptions to the functional
specifications for each silicon revision of this device.
MSP430FR5731 Device Erratasheet. Describes the known exceptions to the functional
specifications for each silicon revision of this device.
MSP430FR5730 Device Erratasheet. Describes the known exceptions to the functional
specifications for each silicon revision of this device.
8.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E™ Community
TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At
e2e.ti.com, you can ask questions, share knowledge, explore ideas, and help solve problems with fellow
engineers.
TI Embedded Processors Wiki
Texas Instruments Embedded Processors Wiki. Established to help developers get started with embedded
processors from Texas Instruments and to foster innovation and growth of general knowledge about the
hardware and software surrounding these devices.
8.4 Trademarks
Code Composer Studio, MSP430, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
8.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
8.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
9 Mechanical Packaging and Orderable Information
9.1 Packaging Information
The following pages include mechanical, packaging, and orderable information. This information is the
most current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2014, Texas Instruments Incorporated
Mechanical Packaging and Orderable Information
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