CC3220MOD_17 Datasheet, PDF (82/88 Pages) Texas Instruments – SimpleLink Wi-Fi CERTIFIED Wireless Module Solutions (S and SF)

CC3220MOD
SWRS206A – MARCH 2017 – REVISED JUNE 2017
www.ti.com
10.2 Package Option Addendum
The CC3220MOD is only offered in a 1000-unit reel.
10.2.1 Packaging Information
Orderable Device
Status ⁽¹⁾
Package
Type
Package Drawing
Pins
Package
Qty
Eco Plan ⁽²⁾
Lead/Ball
Finish
MSL, Peak Temp
(3)
Op Temp (°C)
Device Marking^{(4) (5)}
CC3220MODSM2MOBR
ACTIVE
LGA
MOB
Green
63
1000
(RoHS and
no Sb/Br)
Ni, AU
3, 250°C
–40 to 85
CC3220MODSM2MOB
CC3220MODSF12MOBR
ACTIVE
LGA
MOB
Green
63
1000
(RoHS and
no Sb/Br)
Ni, AU
3, 250°C
–40 to 85
CC3220MODSF12MOB
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
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(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest
availability information and additional product content details.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the
requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified
lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used
between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by
weight in homogeneous material)
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(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device
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(5) Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief
on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third
parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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Mechanical, Packaging, and Orderable Information
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