OMAP3530_14 Datasheet, PDF (8/266 Pages) Texas Instruments – Applications Processors

OMAP3530, OMAP3525
SPRS507H – FEBRUARY 2008 – REVISED OCTOBER 2013
1 OMAP3530 and OMAP3525 Applications
Processors ............................................... 1
1.1 Features ............................................. 1
1.2 Applications .......................................... 3
1.3 Description ........................................... 4
1.4 Functional Block Diagram ........................... 5
Revision History .............................................. 9
2 TERMINAL DESCRIPTION ........................... 10
2.1 Terminal Assignment ............................... 10
2.2 Pin Assignments .................................... 14
2.3 Ball Characteristics ................................. 27
2.4 Multiplexing Characteristics ........................ 86
2.5 Signal Description .................................. 94
3 ELECTRICAL CHARACTERISTICS ............... 119
3.1 Power Domains ................................... 119
3.2 Absolute Maximum Ratings ....................... 121
3.3 Recommended Operating Conditions ............. 123
3.4 DC Electrical Characteristics ...................... 125
3.5 Core Voltage Decoupling ......................... 128
3.6 Power-up and Power-down ....................... 130
4 CLOCK SPECIFICATIONS .......................... 134
4.1 Input Clock Specifications ......................... 135
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4.2 Output Clock Specifications ....................... 140
4.3 DPLL and DLL Specifications ..................... 142
5 VIDEO DAC SPECIFICATIONS .................... 148
5.1 Interface Description .............................. 148
5.2 Electrical Specifications Over Recommended
Operating Conditions .............................. 150
5.3 Analog Supply (vdda_dac) Noise Requirements . 152
5.4 External Component Value Choice ............... 153
6 TIMING REQUIREMENTS AND SWITCHING
CHARACTERISTICS ................................. 154
6.1 Timing Test Conditions ........................... 154
6.2 Interface Clock Specifications ..................... 154
6.3 Timing Parameters ................................ 155
6.4 External Memory Interfaces ....................... 156
6.5 Video Interfaces ................................... 185
6.6 Serial Communications Interfaces ................ 202
6.7 Removable Media Interfaces ...................... 235
6.8 Test Interfaces .................................... 250
7 PACKAGE CHARACTERISTICS ................... 256
7.1 Package Thermal Resistance ..................... 256
7.2 Device Support .................................... 256
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Contents
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