TLC59116-Q1 Datasheet, PDF (5/39 Pages) Texas Instruments – 16-Channel Constant-Current LED Sink Driver

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7 Specifications
TLC59116-Q1
SLDS223A – MARCH 2016 – REVISED MARCH 2016
7.1 Absolute Maximum Ratings
over operating free-air temperature (unless otherwise noted) ⁽¹⁾
V_CC Supply voltage
V_I Input voltage
V_O Output voltage
I_O Output current per channel
T_J Junction temperature
T_stg Storage temperature
MIN
MAX
UNIT
0
7
V
–0.4
–0.5
V_CC + 0.4
V
20
V
120
mA
–40
150
°C
–55
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human-body model (HBM), per AEC Q100-002⁽¹⁾
Charged-device model (CDM), per AEC Q100-011
VALUE
±2000
±1500
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
UNIT
V
7.3 Recommended Operating Conditions
All unused inputs of the device must be held at V_CC or GND to ensure proper device operation
V_CC Supply voltage
V_IH High-level input voltage
V_IL
Low-level input voltage
V_O
Supply voltage to output pins
I_OL
Low-level output current sink
I_O
Output current per channel
T_A
Operating free-air temperature
SCL, SDA, RESET, A0, A1, A2, A3
SCL, SDA, RESET, A0, A1, A2, A3
OUT0 to OUT15
SDA
OUT0 to OUT15
V_CC = 3 V
V_CC = 5 V
MIN
3
0.7 × V_CC
0
5
–40
MAX UNIT
5.5 V
V_CC V
0.3 × V_CC V
17 V
20
mA
30
120 mA
105 °C
7.4 Thermal Information
THERMAL METRIC ⁽¹⁾
TLC59116-Q1
PW (TSSOP)
UNIT
28 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
78
°C/W
18.8
°C/W
36
°C/W
0.5
°C/W
35.5
°C/W
n/a
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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