SM72501 Datasheet, PDF (5/28 Pages) National Semiconductor (TI) – SolarMagic Precision, CMOS Input, RRIO, Wide Supply Range Amplifier

SM72501
www.ti.com
SNIS157C – JANUARY 2011 – REVISED APRIL 2013
±5V Electrical Characteristics⁽¹⁾
Unless otherwise specified, all limits are specified for T_A = 25°C, V⁺ = 5V, V^− = −5V, V_CM = 0V, and R_L > 10 kΩ to 0V.
Boldface limits apply at the temperature extremes.
Symbol
Parameter
Conditions
Min ⁽²⁾
Typ ⁽³⁾
Max ⁽²⁾
Units
V_OS
TCV_OS
I_B
Input Offset Voltage
Input Offset Voltage Temperature Drift
Input Bias Current
I_OS
CMRR
Input Offset Current
Common Mode Rejection Ratio
PSRR Power Supply Rejection Ratio
See ⁽⁴⁾
See ^{(4) (5)}
−40°C ≤ T_A ≤ 85°C
See ^{(4) (5)}
−40°C ≤ T_A ≤ 125°C
−5V ≤ V_CM ≤ 5V
2.7V ≤ V⁺ ≤ 12V, V_O = 0V
±37
±200
±500
μV
±1
±5
μV/°C
±0.2
1
±50
pA
±0.2
1
±400
40
fA
92
138
88
dB
86
98
82
dB
CMVR Common Mode Voltage Range
CMRR ≥ 80 dB
CMRR ≥ 78 dB
−5.2
−5.2
5.2
5.2
V
A_VOL
Open Loop Voltage Gain
V_OUT
Output Voltage Swing High
R_L = 2 kΩ
V_O = −4.7V to 4.7V
R_L = 10 kΩ
V_O = −4.8V to 4.8V
R_L = 2 kΩ to 0V
R_L = 10 kΩ to 0V
100
121
98
dB
100
134
98
90
150
170
mV
40
80
from V⁺
100
Output Voltage Swing Low
I_OUT
Output Current⁽⁶⁾⁽⁷⁾
I_S
Supply Current
SR
Slew Rate⁽⁸⁾
R_L = 2 kΩ to 0V
R_L = 10 kΩ to 0V
Sourcing V_O = 0V
V_IN = 100 mV
Sinking V_O = 0V
V_IN = −100 mV
A_V = +1, V_O = 9 V_PP
10% to 90%
90
130
150
mV
40
50
from V^–
60
50
86
35
mA
50
84
35
0.790
1.1
1.3
mA
1.1
V/μs
GBW
Gain Bandwidth
2.5
MHz
THD+N
e_n
i_n
Total Harmonic Distortion + Noise
Input Referred Voltage Noise Density
Input Referred Current Noise Density
f = 1 kHz, A_V = 1, R_L = 10 kΩ
f = 1 kHz
f = 100 kHz
0.02
%
9
nV/√Hz
1
fA/√Hz
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that T_J = T_A. Parametric performance is indicated in the electrical tables under conditions of
internal self-heating where T_J > T_A.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlations using the
Statistical Quality Control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested on shipped production material.
(4) This parameter is specified by design and/or characterization and is not tested in production.
(5) Positive current corresponds to current flowing into the device.
(6) The maximum power dissipation is a function of T_J(MAX), θ_JA. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX) – T_A)/ θ_JA. All numbers apply for packages soldered directly onto a PC Board.
(7) The short circuit test is a momentary test.
(8) The number specified is the slower of positive and negative slew rates.
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