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SM72501 Datasheet, PDF (4/28 Pages) National Semiconductor (TI) – SolarMagic Precision, CMOS Input, RRIO, Wide Supply Range Amplifier
SM72501
SNIS157C – JANUARY 2011 – REVISED APRIL 2013
www.ti.com
5V Electrical Characteristics(1)
Unless otherwise specified, all limits are specified for TA = 25°C, V+ = 5V, V− = 0V, VCM = V+/2, and RL > 10 kΩ to V+/2.
Boldface limits apply at the temperature extremes.
Symbol
Parameter
Conditions
Min (2)
Typ (3)
Max (2)
Units
VOS
TCVOS
IB
Input Offset Voltage
Input Offset Voltage Temperature Drift
Input Bias Current
IOS
CMRR
Input Offset Current
Common Mode Rejection Ratio
PSRR Power Supply Rejection Ratio
See (4)
See (4) (5)
−40°C ≤ TA ≤ 85°C
See (4) (5)
−40°C ≤ TA ≤ 125°C
0V ≤ VCM ≤ 5V
2.7V ≤ V+ ≤ 12V, VO = V+/2
±37
±200
±500
μV
±1
±5
μV/°C
±0.2
±1
±50
pA
±0.2
±1
±400
40
fA
88
130
83
dB
86
100
82
dB
CMVR Common Mode Voltage Range
CMRR ≥ 80 dB
CMRR ≥ 78 dB
–0.2
–0.2
5.2
5.2
V
AVOL
Open Loop Voltage Gain
VOUT
Output Voltage Swing High
Output Voltage Swing Low
IOUT
Output Current(6)(7)
IS
Supply Current
SR
Slew Rate(8)
RL = 2 kΩ
VO = 0.3V to 4.7V
RL = 10 kΩ
VO = 0.2V to 4.8V
RL = 2 kΩ to V+/2
RL = 10 kΩ to V+/2
RL = 2 kΩ to V+/2
RL = 10 kΩ to V+/2
Sourcing VO = V+/2
VIN = 100 mV
Sinking VO = V+/2
VIN = −100 mV
AV = +1, VO = 4 VPP
10% to 90%
100
119
96
dB
100
130
96
60
110
130
mV
40
50
from V+
70
50
80
90
mV
30
40
50
40
66
28
mA
40
76
28
0.715
1.0
1.2
mA
1.0
V/μs
GBW
Gain Bandwidth
2.5
MHz
THD+N
en
in
Total Harmonic Distortion + Noise
Input Referred Voltage Noise Density
Input Referred Current Noise Density
f = 1 kHz, AV = 1, RL = 10 kΩ
f = 1 kHz
f = 100 kHz
0.02
%
9
nV/√Hz
1
fA/√Hz
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that TJ = TA. Parametric performance is indicated in the electrical tables under conditions of
internal self-heating where TJ > TA.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlations using the
Statistical Quality Control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested on shipped production material.
(4) This parameter is specified by design and/or characterization and is not tested in production.
(5) Positive current corresponds to current flowing into the device.
(6) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.
(7) The short circuit test is a momentary test.
(8) The number specified is the slower of positive and negative slew rates.
4
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