SM72501 Datasheet, PDF (2/28 Pages) National Semiconductor (TI) – SolarMagic Precision, CMOS Input, RRIO, Wide Supply Range Amplifier

SM72501
SNIS157C – JANUARY 2011 – REVISED APRIL 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings⁽¹⁾⁽²⁾
ESD Tolerance⁽³⁾
Charge-Device Model
V_IN Differential
Supply Voltage (V_S = V⁺ – V^−)
Voltage at Input/Output Pins
Input Current
Storage Temperature Range
Junction Temperature⁽⁴⁾
Soldering Information
Human Body Model
Machine Model
Infrared or Convection (20 sec)
Wave Soldering Lead Temp. (10 sec)
2000V
200V
1000V
±300 mV
13.2V
V⁺+ 0.3V, V^− − 0.3V
10 mA
−65°C to +150°C
+150°C
235°C
260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional. For specifications and the test conditions, see the Electrical Characteristics Tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) The maximum power dissipation is a function of T_J(MAX), θ_JA. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX) – T_A)/ θ_JA. All numbers apply for packages soldered directly onto a PC Board.
Operating Ratings⁽¹⁾
Temperature Range⁽²⁾
Supply Voltage (V_S = V⁺ – V^−)
Package Thermal Resistance (θ_JA(2))
5-Pin SOT-23
−40°C to +125°C
2.7V to 12V
265°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional. For specifications and the test conditions, see the Electrical Characteristics Tables.
(2) The maximum power dissipation is a function of T_J(MAX), θ_JA. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX) – T_A)/ θ_JA. All numbers apply for packages soldered directly onto a PC Board.
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