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SM72501 Datasheet, PDF (3/28 Pages) National Semiconductor (TI) – SolarMagic Precision, CMOS Input, RRIO, Wide Supply Range Amplifier
SM72501
www.ti.com
SNIS157C – JANUARY 2011 – REVISED APRIL 2013
3V Electrical Characteristics(1)
Unless otherwise specified, all limits are specified for TA = 25°C, V+ = 3V, V− = 0V, VCM = V+/2, and RL > 10 kΩ to V+/2.
Boldface limits apply at the temperature extremes.
Symbol
Parameter
Conditions
Min (2)
Typ (3)
Max (2)
Units
VOS
TCVOS
IB
IOS
CMRR
PSRR
Input Offset Voltage
Input Offset Voltage Temperature
Drift
Input Bias Current
Input Offset Current
Common Mode Rejection Ratio
Power Supply Rejection Ratio
See (4)
See (4) (5)
−40°C ≤ TA ≤ 85°C
See (4) (5)
−40°C ≤ TA ≤ 125°C
0V ≤ VCM ≤ 3V
2.7V ≤ V+ ≤ 12V, Vo = V+/2
±37
±200
±500
μV
±1
±5
μV/°C
±0.2
±1
±50
pA
±0.2
±1
±400
40
fA
86
130
80
dB
86
98
82
dB
CMVR
Common Mode Voltage Range
CMRR ≥ 80 dB
CMRR ≥ 77 dB
–0.2
–0.2
3.2
3.2
V
AVOL
Open Loop Voltage Gain
VOUT
Output Voltage Swing High
Output Voltage Swing Low
IOUT
Output Current(6)(7)
IS
Supply Current
SR
Slew Rate(8)
RL = 2 kΩ
VO = 0.3V to 2.7V
RL = 10 kΩ
VO = 0.2V to 2.8V
RL = 2 kΩ to V+/2
RL = 10 kΩ to V+/2
RL = 2 kΩ to V+/2
RL = 10 kΩ to V+/2
Sourcing VO = V+/2
VIN = 100 mV
Sinking VO = V+/2
VIN = −100 mV
AV = +1, VO = 2 VPP
10% to 90%
100
114
96
dB
100
124
96
40
80
120
mV
30
40
from V+
60
40
60
80
mV
20
40
50
25
42
15
mA
25
42
20
0.670
1.0
1.2
mA
0.9
V/μs
GBW
Gain Bandwidth
2.5
MHz
THD+N
en
Total Harmonic Distortion + Noise
Input Referred Voltage Noise
Density
f = 1 kHz, AV = 1, R.L = 10 kΩ
f = 1 kHz
0.02
%
9
nV/√Hz
in
Input Referred Current Noise
f = 100 kHz
Density
1
fA/√Hz
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that TJ = TA. Parametric performance is indicated in the electrical tables under conditions of
internal self-heating where TJ > TA.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlations using the
Statistical Quality Control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested on shipped production material.
(4) This parameter is specified by design and/or characterization and is not tested in production.
(5) Positive current corresponds to current flowing into the device.
(6) The maximum power dissipation is a function of TJ(MAX), θJA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX) – TA)/ θJA. All numbers apply for packages soldered directly onto a PC Board.
(7) The short circuit test is a momentary test.
(8) The number specified is the slower of positive and negative slew rates.
Copyright © 2011–2013, Texas Instruments Incorporated
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