LMH0384 Datasheet, PDF (5/29 Pages) National Semiconductor (TI) – 3 Gbps HD/SD SDI Extended Reach and Configurable Adaptive Cable Equalizer

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LMH0384
SNLS308G – APRIL 2009 – REVISED JUNE 2015
6 Specifications
6.1 Absolute Maximum Ratings⁽¹⁾
Supply voltage
Input voltage (all inputs)
Junction temperature
Storage temperature
MIN
−0.3
−65
MAX
4.0
V_CC+0.3
125
150
UNIT
V
V
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
Machine model (MM)
VALUE
±6500
±2000
±400
UNIT
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 500-V HBM is possible with the necessary precautions. Pins listed as ±6500 V may actually have higher performance.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with
less than 250-V CDM is possible with the necessary precautions. Pins listed as ±2000 V may actually have higher performance.
6.3 Recommended Operating Conditions
V_CC – V_EE
T_A
Supply Voltage
Input Coupling Capacitance
AEC Capacitor (Connected between AEC+ and AEC-)
Operating Free Air Temperature
MIN
3.135
−40
NOM
3.3
1
1
MAX
3.465
85
UNIT
V
µF
µF
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
LMH0384
WQFN (RUM)
UNIT
16 PINS
R_θJA
R_θJC(top)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
40
°C/W
6
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 DC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified.^(1)(2)(3)(4)
PARAMETER
TEST CONDITIONS
MIN
V_IH
Input Voltage High Level (Logic Inputs)
2
V_IL
Input Voltage Low Level
V_EE
V_SDI
Input Voltage Swing (SDI, SDI)
0 m cable length⁽⁵⁾
720
V_CMIN
Input Common-Mode Voltage (SDI, SDI)
TYP
800
1.75
MAX
V_CC
0.8
950
UNIT
V
V
mV_P−P
V
(1) Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated
referenced to V_EE = 0 Volts.
(2) Typical values are stated for V_CC = +3.3 V and T_A = +25°C.
(3) Typical pullup or pulldown for digital pin is 100 kΩ.
(4) Due to SMPTE naming convention, all SMPTE Engineering Documents will be numbered as a two-letter prefix and a number.
Documents and references with the same root number and year are functionally identical; for example ST 424-2006 and SMPTE 424M-
2006l refer to the same document.
(5) The LMH0384 can be optimized for different launch amplitudes through the SPI.
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