LMH0384 Datasheet, PDF (2/29 Pages) National Semiconductor (TI) – 3 Gbps HD/SD SDI Extended Reach and Configurable Adaptive Cable Equalizer

LMH0384
SNLS308G – APRIL 2009 – REVISED JUNE 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings.............................................................. 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information .................................................. 5
6.5 DC Electrical Characteristics .................................... 5
6.6 AC Electrical Characteristics..................................... 6
6.7 Timing Requirements ................................................ 7
6.8 Switching Characteristics .......................................... 7
6.9 Typical Characteristics .............................................. 9
7 Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 10
7.3 Feature Description................................................. 10
7.4 Device Functional Modes........................................ 12
7.5 Programming........................................................... 13
7.6 Register Maps ......................................................... 16
8 Application and Implementation ........................ 18
8.1 Application Information............................................ 18
8.2 Typical Application .................................................. 18
8.3 Dos and Don'ts........................................................ 20
9 Power Supply Recommendations...................... 21
10 Layout................................................................... 21
10.1 Layout Guidelines ................................................. 21
10.2 Layout Example .................................................... 22
11 Device and Documentation Support ................. 23
11.1 Documentation Support ........................................ 23
11.2 Community Resources.......................................... 23
11.3 Trademarks ........................................................... 23
11.4 Electrostatic Discharge Caution ............................ 23
11.5 Glossary ................................................................ 23
12 Mechanical, Packaging, and Orderable
Information ........................................................... 23
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision F (April 2013) to Revision G
Page
• Added, updated, or renamed the following sections: Device Information Table, Pin Configuration and Functions;
Specifications; Applications and Implementation; Detailed Description; Layout;Device and Documentation Support;
Mechanical, Packaging, and Ordering Information ............................................................................................................... 1
• Added "(logic zero)" to Pin 14 - MUTE - in Pin Descriptions – Pin Mode (non-SPI) / SPI_EN = GND / LMH0344
Compatible table..................................................................................................................................................................... 3
• Added note "Typical pullup or pulldown for digital pin is 100 kΩ. The tolerance is between 69K to 131K" to DC
Electrical Characteristics ........................................................................................................................................................ 5
Changes from Revision E (April 2013) to Revision F
Page
• Changed layout of National Data Sheet to TI format ........................................................................................................... 17
2
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