DRV8801-Q1_16 Datasheet, PDF (5/28 Pages) Texas Instruments – DMOS Full-Bridge Motor Drivers

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6 Specifications
DRV8801-Q1
SLVSAS7B – FEBRUARY 2011 – REVISED JANUARY 2016
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾
V_BB
I_OUT
V_Sense
V_{BB_OUT}
V_{OUT_SEN}
V_DD
P_D
T_A
T_J
T_stg
Load supply voltage⁽²⁾
Output current
Sense voltage
VBB to OUTx
OUTx to SENSE
Logic input voltage⁽²⁾
Continuous total power dissipation
Operating free-air temperature
Maximum junction temperature
Storage temperature
MIN
MAX
–0.3
40
0
2.8
–500
500
36
36
–0.3
7
See Thermal Information
–40
125
–40
150
–40
125
UNIT
V
A
mV
V
V
V
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human body model (HBM), per AEC Q100-002⁽¹⁾
Charged device model (CDM), per
AEC Q100-011
Corner pins (1, 4, 5, 8,
9, 12, 13, and 16)
Other pins
MIN
–2000
–750
–500
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
MAX
2000
750
500
UNIT
V
6.3 Recommended Operating Conditions
V_BB
V_DD
f_PWM
T_A
Power supply voltage
Logic voltage
Applied PWM signal (PHASE and ENABLE)
Ambient temperature
MIN
MAX
UNIT
8
38
V
0
5.5
V
0
100
kHz
–40
125
°C
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
DRV8801-Q1
RTY (QFN)
UNIT
16 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
46.1
°C/W
43.0
°C/W
22.5
°C/W
0.6
°C/W
22.5
°C/W
3.8
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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