DRV8801-Q1_16 Datasheet, PDF (19/28 Pages) Texas Instruments – DMOS Full-Bridge Motor Drivers

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10 Layout
DRV8801-Q1
SLVSAS7B – FEBRUARY 2011 – REVISED JANUARY 2016
10.1 Layout Guidelines
• The printed-circuit-board (PCB) should use a heavy ground plane. For optimal electrical and thermal
performance, the DRV8801-Q1 must be soldered directly onto the board. On the underside of the DRV8801-
Q1 is a thermal pad, which provides a path for enhanced thermal dissipation. The thermal pad should be
soldered directly to an exposed surface on the PCB. Thermal vias are used to transfer heat to other layers of
the PCB.
• The load supply pin VBB, should be decoupled with an electrolytic capacitor (typically 100 µF) in parallel with
a ceramic capacitor (0.1 µF) placed as close as possible to the device.
• The ceramic capacitors (0.1 µF) between VCP and VBB and between CP1 and CP2 should be placed as
close as possible to the device.
• The SENSE resistor should be close as possible to the SENSE pin and ground return to minimize parasitic
inductance.
10.2 Layout Example
GND
GND
PHASE
GND
nSLEEP
ENABLE
0.1 µF
GND
GND
CP2
CP1
OUT-
GND
0.1 µF
0.1 µF
0.2 Ÿ
GND
VBB
GND
BDC
GND
Figure 14. RTY Layout Example
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