AMC1204_15 Datasheet, PDF (5/37 Pages) Texas Instruments – AMC1204 20-MHz, Second-Order, Isolated Delta-Sigma Modulator

www.ti.com
AMC1204, AMC1204B
SBAS512E – APRIL 2011 – REVISED SEPTEMBER 2015
6 Specifications
6.1 Absolute Maximum Ratings
Over the operating ambient temperature range, unless otherwise noted. ⁽¹⁾
Supply voltage, AVDD to AGND or DVDD to DGND
Analog input voltage at VINP, VINN
Digital input voltage at CLKIN
Input current to any pin except supply pins
Maximum virtual junction temperature, T_J
Operating ambient temperature, T_OA
Storage temperature, T_stg
MIN
–0.3
AGND – 0.5
DGND – 0.3
–10
–40
–65
MAX
6
AVDD + 0.5
DVDD + 0.3
10
150
125
150
UNIT
V
V
V
mA
°C
°C
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under the Electrical Characteristics
is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V_(ESD) Electrostatic discharge
Human-body model (HBM), per JEDEC standard 22, test method A114-
C.01 ⁽¹⁾
Charged-device model (CDM), per JEDEC standard 22, test method
C101 ⁽²⁾
Machine model (MM), per JEDEC standard 22, test method A115A
VALUE
±3000
±1500
±200
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
T_A
Operating ambient temperature
–40
AVDD
High-side (analog) supply voltage
4.5
DVDD
Controller-side (digital) supply voltage
2.7
NOM
5
3.3
MAX
105
5.5
5.5
UNIT
°C
V
V
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
AMC1204, AMC1204B
DW (SOIC)
DWV (SOIC)
UNIT
16 PINS
8 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
78.5
106.5
°C/W
41.3
53.6
°C/W
50.2
60.3
°C/W
11.5
18.5
°C/W
41.2
58.9
°C/W
n/a
n/a
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
Copyright © 2011–2015, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: AMC1204 AMC1204B