OPA2333-HT Datasheet, PDF (4/23 Pages) Texas Instruments – 1.8-V MICROPOWER CMOS OPERATIONAL AMPLIFIER ZERO-DRIFT SERIES

OPA2333-HT
SBOS483F – JULY 2009 – REVISED AUGUST 2012
www.ti.com
THERMAL CHARACTERISTICS FOR JD PACKAGE
over operating free-air temperature range (unless otherwise noted)
PARAMETER
θ_JA
Junction-to-ambient thermal
resistance ⁽¹⁾
TEST CONDITIONS
High-K board⁽²⁾, no airflow
No airflow
MIN
TYP
MAX UNIT
64.9
°C/W
83.4
θ_JB
Junction-to-board thermal resistance High-K board without underfill
θ_JC
Junction-to-case thermal resistance
27.9
°C/W
6.49
°C/W
(1) The intent of θ_JA specification is solely for a thermal performance comparison of one package to another in a standardized environment.
This methodology is not meant to and will not predict the performance of a package in an application-specific environment.
(2) JED51-7, high effective thermal conductivity test board for leaded surface mount packages
THERMAL CHARACTERISTICS FOR HKJ OR HKQ PACKAGE
over operating free-air temperature range (unless otherwise noted)
PARAMETER
to ceramic side of case
θ_JC
Junction-to-case thermal resistance
to top of case lid (metal side of case)
MIN
TYP
MAX UNIT
5.7
°C/W
13.7
THERMAL CHARACTERISTICS FOR D PACKAGE
over operating free-air temperature range (unless otherwise noted)
PARAMETER
θ_JC
Junction-to-case thermal resistance (to bottom of case)
MIN TYP
MAX
39.4
UNIT
°C/W
Absolute Maximum Ratings⁽¹⁾
over operating free-air temperature range (unless otherwise noted)
Supply voltage
Signal input terminals, voltage⁽²⁾
Output short circuit⁽³⁾
Operating temperature range
Junction temperature
ESD rating
JD, HKJ, HKQ packages
D package
JD, HKJ, HKQ packages
D package
Human-Body Model (HBM)
Charged-Device Model (CDM)
MIN
MAX UNIT
7V
–0.3 (V+) + 0.3 V
Continuous
–55
210
°C
–55
175
210
°C
175
4000
V
1000
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input terminals are diode clamped to the power-supply rails. Input signals that can swing more than 0.3 V beyond the supply rails should
be current limited to 10 mA or less.
(3) Short circuit to ground, one amplifier per package.
4
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