OPA2333-HT Datasheet, PDF (2/23 Pages) Texas Instruments – 1.8-V MICROPOWER CMOS OPERATIONAL AMPLIFIER ZERO-DRIFT SERIES

OPA2333-HT
SBOS483F – JULY 2009 – REVISED AUGUST 2012
www.ti.com
Table 1. ORDERING INFORMATION⁽¹⁾
TA
–55°C to 210°C
–55°C to 175°C
PACKAGE
KGD
JD
HKJ
HKQ
D
ORDERABLE PART NUMBER
OPA2333SKGD1
OPA2333SJD
OPA2333SHKJ
OPA2333SHKQ
OPA2333HD
TOP-SIDE MARKING
NA
OPA2333SJD
OPA2333SHKJ
OPA2333SHKQ
O2333H
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
BARE DIE INFORMATION
DIE THICKNESS
15 mils.
BACKSIDE FINISH
Silicon with backgrind
BACKSIDE
POTENTIAL
V-
BOND PAD
METALLIZATION COMPOSITION
Al-Si-Cu (0.5%)
DESCRIPTION
OUT A
–IN A
+IN A
V–
+IN B
–IN B
OUT B
V+
PAD NUMBER
1
2
3
4
5
6
7
8
Table 2. BOND PAD COORDINATES
a
21.20
21.20
21.20
31.30
864.80
864.80
864.80
854.70
b
1288.50
923.65
533.05
172.20
162.25
552.65
897.10
1280.45
c
97.20
97.20
97.20
107.30
940.80
940.80
940.80
930.70
d
1364.50
999.65
609.05
248.20
238.25
628.65
973.10
1356.45
2
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