DRV401-Q1 Datasheet, PDF (4/39 Pages) Texas Instruments – DRV401-Q1 Sensor Signal Conditioning Device for Closed-Loop Magnetic Current Sensor

DRV401-Q1
SBOS814 – DECEMBER 2016
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted).⁽¹⁾
Voltage
Differential amplifier
Current
Temperature
Supply voltage
Signal input pin
Signal input pin
Signal input pin, IS1 and IS2
Pins other than IS1 and IS2
I_COMP short circuit
Operating, T_A
Junction, T_J
Storage, T_stg
MIN
−0.5
–10
–75
–25
0
–50
–55
MAX
7
V_DD + 0.5
10
75
25
250
150
150
150
UNIT
V
mA
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human-body model (HBM), per AEC Q100-002 ⁽¹⁾
Charged-device model (CDM), per AEC Q100-011
Pins IA_IN1 and IA_IN2
All other pins
All pins
Corner pins
VALUE
±1000
±5000
±1000
±1000
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
Power supply voltage, V_DD1, V_DD2
Specified temperature range
MIN
NOM
MAX UNIT
4.5
5
5.5
V
–40
25
+125
°C
6.4 Thermal Information
over operating free-air temperature range (unless otherwise noted)
DRV401-Q1
THERMAL METRIC⁽¹⁾
RGW
(VQFN)
UNIT
20 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
34.1
°C/W
22.8
°C/W
12.1
°C/W
0.3
°C/W
12.0
°C/W
3.5
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
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