DRV401-Q1 Datasheet, PDF (30/39 Pages) Texas Instruments – DRV401-Q1 Sensor Signal Conditioning Device for Closed-Loop Magnetic Current Sensor

DRV401-Q1
SBOS814 – DECEMBER 2016
10.2 Layout Example
+5V
Probe coil
20 19 18 17 16
1
15
2
Exposed
14
3
thermal pad,
13
connect to
4
GND1
12
5
11
6 7 8 9 10
VOUT
+5V
Compensation
coil
+5V
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Instruments Incorporated
Figure 50. DRV401-Q1 Layout Example (RGW Package)
10.3 Power Dissipation
Using the thermally-enhanced VQFN package dramatically reduces the thermal impedance from junction to case.
This package is constructed using a down-set lead frame that the die is mounted on. This arrangement results in
the lead frame exposed as a thermal pad on the underside of the package. Because this thermal pad has direct
thermal contact with the die, excellent thermal performance can be achieved by providing a good thermal path
away from the thermal pad.
The two outputs (I_COMP1 and I_COMP2) are linear outputs. Therefore, the power dissipation on each output is
proportional to the current multiplied by the internal voltage drop on the active transistor. For I_COMP1 and I_COMP2,
this internal voltage drop is the voltage drop to V_DD2 or GND, according to the current-conducting side of the
output.
Output short-circuits are particularly critical for the driver because the full supply voltage can be seen across the
conducting transistor, and the current is not limited by anything other than the current density limitation of the
FET. Permanent damage to the device may occur.
The DRV401-Q1 does not include temperature protection or thermal shutdown.
30
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