DRV2624 Datasheet, PDF (4/79 Pages) Texas Instruments – DRV2624 Ultra Low Power Closed-Loop LRA/ERM Haptic Driver with Internal Memory

DRV2624
SLOS893A – DECEMBER 2015 – REVISED DECEMBER 2015
6 Specifications
www.ti.com
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) ⁽¹⁾
Supply Voltage
V_DD
NRST
Input voltage
SDA
SCL
TRIG/INTZ
Operating free-air temperature range, T_A
Operating junction temperature range, T_J
Storage temperature, T_stg
MIN
MAX
UNIT
–0.3
6
V
–0.3
6
V
–0.3
6
V
–0.3
6
V
–0.3
6
V
–40
85
°C
–40
150
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V_(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins ⁽¹⁾
Charged device model (CDM), per JEDEC specification
JESD22-C101, all pins⁽²⁾
MIN
–1500
–500
MAX
1500
500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_DD
R_L
C_L
ƒ_(LRA)
Supply voltage
Load impedance
Load capacitance
LRA frequency
MIN
NOM
MAX UNIT
2.7
5.5
V
8
Ω
100
pF
45
300
Hz
6.4 Thermal Information
THERMAL METRIC⁽¹⁾
DRV2625
DSBGA
UNIT
9 PINS
R_θJA
R_θJC(top)
R_θJB
ψ_JT
ψ_JB
R_θJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
107
°C/W
0.9
°C/W
18.1
°C/W
3.8
°C/W
18.1
°C/W
—
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4
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