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BQ26100_15 Datasheet, PDF (4/29 Pages) Texas Instruments – Based Security and Authentication IC
bq26100
SLUS696B – JUNE 2006 – REVISED AUGUST 2015
www.ti.com
6.4 Thermal Information
THERMAL METRIC(1)
BQ26100
DRP (VSON)
UNIT
6 PINS
RθJA
RθJC(top)
RθJB
ψJT
ψJB
RθJC(bot)
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
51.7
°C/W
68.9
°C/W
24.9
°C/W
1.7
°C/W
25.1
°C/W
4.6
°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 Electrical Characteristics
all parameters over operating free-air temperature and supply voltage range (unless otherwise noted) (memory programming
and authentication were tested with R1 = 4.7 kΩ, C1 = 0.1 μF over pullup voltage range)
PARAMETER
TEST CONDITIONS
MIN TYP MAX UNIT
Power up communication delay
Power capacitor charge time
100
ms
Isleep
Isdq(Vsdq)
Sleep current
Vsdq Current
OTP Memory programming voltage
Vsdq ≥ Vsdq(min)
8
11
μA
50
μA
6.8
7 7.7
V
OTP Memory programming time
100
μs/byte
EEPROM Programming current (peak current)
83
μA
EEPROM Peak current duration
100
μs
EEPROM Programming time
50
ms
SDQ
VIL
Input low-level voltage
IOL
Output low sink current
VOL = 0.4 V
0.63
V
1 mA
6.6 Standard Serial Communication (SDQ) Timing
over recommended operating temperature and supply voltage range (unless otherwise noted) (See Figure 1)
MIN
NOM
tRSTL
tRSTH
tPDL
tPDH
tREC
tSLOT
tLOW1
tLOW0
tLOWR
tSLOT
tSU
tRDV
tRELEASE
Reset time – low
Reset time – high
Presence detect – low
Presence detect – high
Recovery time
Host bit window
Host sends 1
Host sends 0
Host read bit start
bq26100 bit window
bq26100 data setup
bq26100 data valid
bq26100 data release
480
480
60
15
1
60
1
60
1
60
exactly 15
0
15
MAX
240
60
120
13
120
13
120
1
45
UNIT
μs
μs
μs
μs
μs
μs
μs
μs
μs
μs
μs
μs
μs
4
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