BQ26100_15 Datasheet, PDF (3/29 Pages) Texas Instruments – Based Security and Authentication IC

www.ti.com
5 Pin Configuration and Functions
DRP Package
6-Pin VSON
Top View
1
2
3
bq26100
SLUS696B – JUNE 2006 – REVISED AUGUST 2015
Exposed
Thermal Pad
1.6 mm
2.3 mm
3 mm
6
5
4
3 mm
NAME
PWR
SDQ
VSS
PIN
NO.
1
6
2, 3, 4, 5
Pin Functions
I/O
DESCRIPTION
I/O Power capacitor connection
I/O Single wire SDQ interface to host
I Ground
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
MIN
MAX
UNIT
Supply voltage (SDQ all with respect to VSS)
–0.3
7.7
V
Output current (SDQ)
5
mA
T_A Operating free-air temperature
T_J Junction temperature
T_stg Storage temperature
–40
85
°C
–40
150
°C
–65
150
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
V_(ESD)
Electrostatic
discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001⁽¹⁾
Charged-device model (CDM), per JEDEC specification JESD22-C101⁽²⁾
VALUE
2000
1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
UNIT
V
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
V_sdq
Pullup voltage
T_J
Operating free-air temperature range
MIN
MAX UNIT
2.5
V
–40
°C
Copyright © 2006–2015, Texas Instruments Incorporated
Product Folder Links: bq26100
Submit Documentation Feedback
3