BQ24153A_14 Datasheet, PDF (4/46 Pages) Texas Instruments – Fully Integrated Switch-Mode One-Cell Li-Ion Charger With Full USB Compliance and USB-OTG Support

bq24153A, bq24156A
bq24158, bq24159
SLUSAB0C – OCTOBER 2010 – REVISED JULY 2013
www.ti.com
PART NUMBER
bq24153AYFFR
bq24153AYFFT
bq24156AYFFR
bq24156AYFFT
bq24158YFFR
bq24158YFFT
bq24159YFFR
bq24159YFFT
ORDERING INFORMATION ⁽¹⁾
MARKING
MEDIUM
bq24153A
Tape and Reel
bq24153A
Tape and Reel
bq24156A
Tape and Reel
bq24156A
Tape and Reel
bq24158
Tape and Reel
bq24158
Tape and Reel
bq24159
Tape and Reel
bq24159
Tape and Reel
QUANTITY
3000
250
3000
250
3000
250
3000
250
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS^{(1) (2)}
over operating free-air temperature range (unless otherwise noted)
Supply voltage range (with respect to PGND⁽³⁾)
Input voltage range (with respect to PGND⁽³⁾)
VBUS; V_PMID ≥ V_BUS –0.3 V
SCL, SDA, OTG, SLRST, CSIN, CSOUT,
CD
Output voltage range (with respect to PGND⁽³⁾)
PMID, STAT
VREF
SW, BOOT
Voltage difference between CSIN and CSOUT inputs (V_(CSIN) – V_(CSOUT) )
Voltage difference between BOOT and SW inputs (V_(BOOT) – V_(SW) )
Voltage difference between VBUS and PMID inputs (V_(VBUS) – V_(PMID) )
Voltage difference between PMID and SW inputs (V_(PMID) – V_(SW) )
Output sink
STAT
Output Current (average)
SW
T_A Operating free-air temperature range
T_J Junction temperature
T_stg Storage temperature
bq24153A/6A/8/9
–2 to 20
–0.3 to 7
–0.3 to 20
7
–0.7 to 20
±7
–0.3 to 7
–7 to 0.7
–0.7 to 20
10
1.55 ⁽²⁾
–30 to 85
–40 to 125
–45 to 150
UNIT
V
V
V
V
V
V
V
V
V
mA
A
°C
°C
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage
values are with respect to the network ground terminal unless otherwise noted.
(2) Duty cycle for output current should be less than 50% for 10- year life time when output current is above 1.25A.
(3) All voltages are with respect to PGND if not specified. Currents are positive into, negative out of the specified terminal, if not specified.
Consult Packaging Section of the data sheet for thermal limitations and considerations of packages.
THERMAL INFORMATION
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
THERMAL METRIC⁽¹⁾
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
YFF
20 PINS
85
25
55
4
50
n/a
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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