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MSP430G2332-EP Datasheet, PDF (36/55 Pages) Texas Instruments – MIXED SIGNAL MICROCONTROLLER
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MSP430G2332-EP
SLAS885A – AUGUST 2012 – REVISED OCTOBER 2012
www.ti.com
RAM
over recommended ranges of supply voltage and up to operating free-air temperature, TA = 105°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN MAX UNIT
V(RAMh)
RAM retention supply voltage (1)
CPU halted
1.6
V
(1) This parameter defines the minimum supply voltage VCC when the data in RAM remains unchanged. No program execution should
happen during this supply voltage condition.
JTAG and Spy-Bi-Wire Interface
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
fSBW
tSBW,Low
tSBW,En
PARAMETER
Spy-Bi-Wire input frequency
Spy-Bi-Wire low clock pulse length
Spy-Bi-Wire enable time
(TEST high to acceptance of first clock edge(1))
TEST CONDITIONS
VCC
2.2 V
2.2 V
2.2 V
MIN TYP
0
0.025
tSBW,Ret
fTCK
RInternal
Spy-Bi-Wire return to normal operation time
TCK input frequency(2)
Internal pulldown resistance on TEST
TA = -40°C to 105°C
TA = -40°C to 105°C
2.2 V
2.2 V
2.2 V
15
0
25
60
MAX
20
15
1
100
5
90
UNIT
MHz
µs
µs
µs
MHz
kΩ
(1) Tools accessing the Spy-Bi-Wire interface need to wait for the maximum tSBW,En time after pulling the TEST/SBWCLK pin high before
applying the first SBWCLK clock edge.
(2) fTCK may be restricted to meet the timing requirements of the module selected.
JTAG Fuse(1)
TA = 25°C, over recommended ranges of supply voltage (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC(FB)
VFB
IFB
tFB
Supply voltage during fuse-blow condition
Voltage level on TEST for fuse blow
Supply current into TEST during fuse blow
Time to blow fuse
TA = 25°C
MIN MAX UNIT
2.5
V
6
7
V
100 mA
1 ms
(1) Once the fuse is blown, no further access to the JTAG/Test, Spy-Bi-Wire, and emulation feature is possible, and JTAG is switched to
bypass mode.
36
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