MSP430G2332-EP Datasheet, PDF (17/55 Pages) Texas Instruments – MIXED SIGNAL MICROCONTROLLER

MSP430G2332-EP
www.ti.com
SLAS885A – AUGUST 2012 – REVISED OCTOBER 2012
Absolute Maximum Ratings⁽¹⁾
Voltage applied at V_CC to V_SS
Voltage applied to any pin⁽²⁾
Diode current at any device pin
Storage temperature range, T_stg(3)
Unprogrammed device
Programmed device
–0.3 V to 4.1 V
–0.3 V to V_CC + 0.3 V
±2 mA
–55°C to 150°C
–55°C to 150°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages referenced to V_SS. The JTAG fuse-blow voltage, V_FB, is allowed to exceed the absolute maximum rating. The voltage is
applied to the TEST pin when blowing the JTAG fuse.
(3) Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow
temperatures not higher than classified on the device label on the shipping boxes or reels.
xxx
A. See data sheet for absolute maximum and minimum recommended operating conditions.
B. Silicon operating life design goal is 10 years at 110°C junction temperature (does not include package interconnect
life).
C. The predicted operating lifetime vs. junction temperature is based on reliability modeling using electromigration as the
dominant failure mechanism affecting device wearout for the specific device process and design characteristics.
Figure 1. Operating Life Derating Chart
Copyright © 2012, Texas Instruments Incorporated
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