MSP430G2332-EP Datasheet, PDF (30/55 Pages) Texas Instruments – MIXED SIGNAL MICROCONTROLLER

MSP430G2332-EP
SLAS885A – AUGUST 2012 – REVISED OCTOBER 2012
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Crystal Oscillator, XT1, Low-Frequency Mode^{(1) (2)}
over recommended ranges of supply voltage and up to operating free-air temperature, T_A = 105°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
V_CC
MIN TYP MAX UNIT
f_LFXT1,LF
LFXT1 oscillator crystal
frequency, LF mode 0, 1
XTS = 0, LFXT1Sx = 0 or 1
1.8 V to 3.6 V
32768
Hz
f_{LFXT1,LF,logic}
LFXT1 oscillator logic level
square wave input frequency, XTS = 0, XCAPx = 0, LFXT1Sx = 3
LF mode
1.8 V to 3.6 V 10000 32768 50000 Hz
f_{LFXT1,LF,logic}
LFXT1 oscillator logic level
square wave input frequency,
LF mode
XTS = 0, XCAPx = 0, LFXT1Sx = 3,
T_A = -40°C to 125°C
1.8 V to 3.6 V
32768
Hz
OA_LF
Oscillation allowance for
LF crystals
XTS = 0, LFXT1Sx = 0,
f_LFXT1,LF = 32768 Hz, C_L,eff = 6 pF
XTS = 0, LFXT1Sx = 0,
f_LFXT1,LF = 32768 Hz, C_L,eff = 12 pF
XTS = 0, XCAPx = 0
500
kΩ
200
1
C_L,eff
Integrated effective load
capacitance, LF mode⁽³⁾
XTS = 0, XCAPx = 1
XTS = 0, XCAPx = 2
5.5
pF
8.5
XTS = 0, XCAPx = 3
11
Duty cycle
f_Fault,LF
LF mode
Oscillator fault frequency,
LF mode⁽⁴⁾
XTS = 0, Measured at P2.0/ACLK,
f_LFXT1,LF = 32768 Hz
XTS = 0, XCAPx = 0, LFXT1Sx = 3⁽⁵⁾
2.2 V
2.2 V
30
50
70 %
10
10000 Hz
(1) To improve EMI on the XT1 oscillator, the following guidelines should be observed.
(a) Keep the trace between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
(d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
(e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.
(f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
(g) Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation. This
signal is no longer required for the serial programming adapter.
(2) Crystal oscillator cannot be operated beyond 105°C. Parameters are characterized up to T_A = 105°C, unless otherwise noted.
(3) Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Because the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
(4) Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies in between might set the flag.
(5) Measured with logic-level input frequency but also applies to operation with crystals.
Internal Very-Low-Power Low-Frequency Oscillator (VLO)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
f_VLO
df_VLO/d_T
df_VLO/dV_CC
PARAMETER
VLO frequency
VLO frequency temperature drift⁽¹⁾
VLO frequency supply voltage drift⁽²⁾
T_A
-40°C to 85°C
125°C
-40°C to 125°C
25°C
V_CC
3V
3V
1.8 V to 3.6 V
MIN TYP
4
12
0.5
4
MAX
20
23
UNIT
kHz
%/°C
%/V
(1) Calculated using the box method: (MAX(-40°C to 125°C) - MIN(-40°C to 125°C)) / MIN(-40°C to 125°C) / (125°C - (-40°C))
(2) Calculated using the box method: (MAX(1.8 V to 3.6 V) - MIN(1.8 V to 3.6 V)) / MIN(1.8 V to 3.6 V) / (3.6 V - 1.8 V)
Timer_A
over recommended ranges of supply voltage and up to operating free-air temperature, T_A = 105°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
V_CC
MIN TYP MAX UNIT
f_TA
Timer_A input clock frequency
SMCLK
Duty cycle = 50% ± 10%
f_SYSTEM
MHz
t_TA,cap
Timer_A capture timing⁽¹⁾
TA0, TA1
3V
20
ns
(1) Parameter characterized up to T_A = 105°C, unless otherwise noted.
30
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