CC2650MODA Datasheet, PDF (33/40 Pages) Texas Instruments – Low energy Wireless MCU Module

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CC2650MODA
SWRS187A – AUGUST 2016 – REVISED AUGUST 2016
7.2 Layout
7.2.1 Layout Guidelines
Use the following guidelines to lay out the CC2650MODA device:
• The module must be placed close to the edge of the PCB.
• TI recommends leaving copper clearance on all PCB layers underneath the antenna area, as shown in
Figure 7-2 and Figure 7-3.
• TI recommends using a generous amount of ground vias to stitch together the ground planes on
different layers. Several ground vias should be placed close to the exposed ground pads of the
module.
• No external decoupling is required.
• The reset line should have an external pullup resistor unless the line is actively driven. Placement of
this component is not critical.
• TI recommends leaving a clearance in the top-side copper plane underneath the RF test pads.
Figure 7-2. Top Layer
Figure 7-3. Bottom Layer
Copyright © 2016, Texas Instruments Incorporated
Application, Implementation, and Layout
33
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