MSP430FR5972 Datasheet, PDF (29/142 Pages) Texas Instruments – Mixed‑Signal Microcontrollers

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MSP430FR5972, MSP430FR59721, MSP430FR5970, MSP430FR5922, MSP430FR59221
MSP430FR5872, MSP430FR58721, MSP430FR5870
SLASE66A – APRIL 2015 – REVISED MAY 2015
5.10 Typical Characteristics, Current Consumption per Module
MODULE
Timer_A
Timer_B
eUSCI_A
eUSCI_A
eUSCI_B
eUSCI_B
RTC_C
MPY
AES
CRC16
CRC32
TEST CONDITIONS
UART mode
SPI mode
SPI mode
I²C mode, 100 kbaud
Only from start to end of operation
Only from start to end of operation
Only from start to end of operation
Only from start to end of operation
REFERENCE CLOCK
Module input clock
Module input clock
Module input clock
Module input clock
Module input clock
Module input clock
32 kHz
MCLK
MCLK
MCLK
MCLK
MIN TYP MAX UNIT
3
μA/MHz
5
μA/MHz
5.5
μA/MHz
3.5
μA/MHz
3.5
μA/MHz
3.5
μA/MHz
100
nA
25
μA/MHz
21
μA/MHz
2.5
μA/MHz
2.5
μA/MHz
5.11 Thermal Characteristics⁽¹⁾
θ_JA
θ_JC(TOP)
θ_JB
Ψ_JB
Ψ_JT
θ_JC(BOTTOM)
θ_JA
θ_JC(TOP)
θ_JB
Ψ_JB
Ψ_JT
θ_JC(BOTTOM)
θ_JA
θ_JC(TOP)
θ_JB
Ψ_JB
Ψ_JT
θ_JC(BOTTOM)
PARAMETER
Junction-to-ambient thermal resistance, still air⁽²⁾
Junction-to-case (top) thermal resistance⁽³⁾
Junction-to-board thermal resistance⁽⁴⁾
Junction-to-board thermal characterization parameter
Junction-to-top thermal characterization parameter
Junction-to-case (bottom) thermal resistance⁽⁵⁾
Junction-to-ambient thermal resistance, still air⁽²⁾
Junction-to-case (top) thermal resistance⁽³⁾
Junction-to-board thermal resistance⁽⁴⁾
Junction-to-board thermal characterization parameter
Junction-to-top thermal characterization parameter
Junction-to-case (bottom) thermal resistance⁽⁵⁾
Junction-to-ambient thermal resistance, still air⁽²⁾
Junction-to-case (top) thermal resistance⁽³⁾
Junction-to-board thermal resistance⁽⁴⁾
Junction-to-board thermal characterization parameter
Junction-to-top thermal characterization parameter
Junction-to-case (bottom) thermal resistance⁽⁵⁾
PACKAGE
TSSOP-56 (DGG)
QFP-64 (PN)
QFN-64 (RGC)
VALUE ⁽¹⁾
57.7
15.1
26.5
26.2
0.5
N/A
59.3
19.5
30.8
30.5
1.0
N/A
29.6
15.8
8.5
8.5
0.2
1.2
UNIT
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
(1) N/A = not applicable
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-
standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Copyright © 2015, Texas Instruments Incorporated
Specifications
29
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MSP430FR5872 MSP430FR58721 MSP430FR5870