LMH6881 Datasheet, PDF (28/35 Pages) Texas Instruments – Small Signal Bandwidth: 2400 MHz

LMH6881
SNOSC72F – JUNE 2012 – REVISED FEBRUARY 2015
10.2 Layout Example
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Figure 53. Top Layer
A GND layer cut out is beneath
the signal traces to reduce
reduce parasitic capacitance at
the input and outptut pins
Figure 54. GND Layer
10.3 Thermal Considerations
The LMH6881 is packaged in a thermally enhanced package. The exposed pad on the bottom of the package is
the primary means of removing heat from the package. It is recommended, but not necessary, that the exposed
pad be connected to the supply ground plane. In any case, the thermal dissipation of the device is largely
dependent on the attachment of the exposed pad to the system printed circuit board (PCB). The exposed pad
should be attached to as much copper on the PCB as possible, preferably external layers of copper.
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