AM3359_017 Datasheet, PDF (245/253 Pages) Texas Instruments – Sitara Processors

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AM3359, AM3358, AM3357, AM3356, AM3354, AM3352, AM3351
SPRS717J – OCTOBER 2011 – REVISED APRIL 2016
9 Mechanical, Packaging, and Orderable Information
9.1 Via Channel
The ZCE package has been specially engineered with Via Channel technology. This allows larger than
normal PCB via and trace sizes and reduced PCB signal layers to be used in a PCB design with the 0.65-
mm pitch package, and substantially reduces PCB costs. It allows PCB routing in only two signal layers
(four layers total) due to the increased layer efficiency of the Via Channel BGA technology.
Via Channel technology implemented on the ZCE package makes it possible to build an AM335x-based
product with a 4-layer PCB, but a 4-layer PCB may not meet system performance goals. Therefore,
system performance using a 4-layer PCB design must be evaluated during product design.
9.2 Packaging Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and
revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2011–2016, Texas Instruments Incorporated
Mechanical, Packaging, and Orderable Information 245
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