TLC5929 Datasheet, PDF (2/36 Pages) Texas Instruments – 16-Channel, Constant-Current LED Driver with 7-Bit Global Brightness Control, Power-Save Mode

TLC5929
SBVS159 – APRIL 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PRODUCT
TLC5929
PACKAGE/ORDERING INFORMATION⁽¹⁾
PACKAGE-LEAD
PACKAGE
DESIGNATOR
ORDERING
NUMBER
SSOP/QSOP-24
DBQ
TLC5929DBQR
TLC5929DBQ
HTSSOP-24 PowerPAD™
PWP
TLC5929PWPR
TLC5929PWP
TRANSPORT MEDIA,
QUANTITY
Tape and Reel, 2500
Tube, 50
Tape and Reel, 2000
Tube, 60
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the
device product folder at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)⁽¹⁾
Voltage ⁽²⁾
Current
Temperature
Electrostatic Discharge Ratings
VCC
SIN, SCLK, LAT, BLANK, IREF, SOUT
OUT0 to OUT15
OUT0 to OUT15
Operating junction, T_J (max)
Storage, T_STG
Human body model (HBM)
Charged device model (CDM)
VALUE
MIN
MAX
–0.3
+6.0
–0.3 V_CC + 0.3
–0.3
+11
0
+65
–40
+150
–55
+150
4000
2000
UNIT
V
V
V
mA
°C
°C
V
V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.
(2) All voltages are with respect to device ground terminal.
THERMAL INFORMATION
θ_JA
θ_JCtop
θ_JB
ψ_JT
ψ_JB
θ_JCbot
THERMAL METRIC⁽¹⁾
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
TLC5929
DBQ
PWP
24 PINS
24 PINS
85.3
37.6
48.8
24.5
38.6
11.5
11.9
0.5
38.3
11.3
N/A
5.7
UNITS
°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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