LMH7322_14 Datasheet, PDF (2/33 Pages) Texas Instruments – Dual 700 ps High Speed Comparator with RSPECL Outputs

LMH7322
SNOSAU8H – MARCH 2007 – REVISED MAY 2011
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings ⁽¹⁾⁽²⁾
ESD Tolerance ⁽³⁾
Human Body Model
Machine Model
Output Short Circuit Duration
Supply Voltages (V_CCx–V_EE)
Differential Voltage at Input Pins
Voltage at Input Pins
Voltage at LE Pins
Current at Output Pins
Soldering Information:
See Product Folder at www.ti.com and SNOA549
Storage Temperature Range
Junction Temperature ⁽⁷⁾
2.5 kV
250V
See ^{(4) (5) (6)}
13.2V
±13V
V_EE-0.2V to V_CCI + 0.2V
V_EE-0.2V to V_CCO+0.2V
25mA
−65°C to +150°C
+150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(5) Short circuit test is a momentary test. See next note.
(6) The maximum power dissipation is a function of T_J(MAX), θ_JA. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX) – T_A)/ θ_JA. All numbers apply for packages soldered directly onto a PC Board.
(7) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped
production material.
Operating Conditions ⁽¹⁾
Supply Voltage (V_CCx–V_EE)
Operating Temperature Range
(2) (3)
Package Thermal Resistance
(2) (3)
2.7V to 12V
−40°C to +125°C
24-Pin WQFN
38°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of T_J(MAX), θ_JA. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX) – T_A)/ θ_JA. All numbers apply for packages soldered directly onto a PC Board.
(3) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device such that T_J = T_A. No specification of parametric performance is indicated in the electrical tables under
conditions of internal self-heating where T_J > T_A. See Applications section for information on temperature de-rating of this device.
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