LMH7220_14 Datasheet, PDF (2/34 Pages) Texas Instruments – LMH7220 High Speed Comparator with LVDS Output

LMH7220
SNOSAL3E – SEPTEMBER 2006 – REVISED MAY 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS ⁽¹⁾⁽²⁾
ESD Tolerance ⁽³⁾
Human Body Model
Machine Model
Supply Voltage (V_CC - GND)
Differential Input Voltage
Output Shorted to GND ⁽⁴⁾
Output Shorted Together ⁽⁴⁾
Storage Temperature Range
Voltage on any I/O Pin
Junction Temperature ⁽⁵⁾
2.5 kV
250V
13.5V
±13V
Continuous
Continuous
−65°C to +150°C
GND−0.2V to V_CC+0.2V
150°C max
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Conditions indicate specifications
for which the device is intended to be functional, but specific performance is not ensured. For specifications and the test conditions, see
the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC). Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC)
(4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(5) The maximum power dissipation is a function of T_J(MAX), θ_JA. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX) – T_A)/ θ_JA. All numbers apply for packages soldered directly onto a PC Board.
OPERATING RATINGS ⁽¹⁾
Temperature Range ⁽²⁾
−40°C to +125°C
Supply Voltage
2.7V to 13V
Package Thermal Resistance (θ_JA )
6-Pin SOT
189°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Conditions indicate specifications
for which the device is intended to be functional, but specific performance is not ensured. For specifications and the test conditions, see
the Electrical Characteristics.
(2) The maximum power dissipation is a function of T_J(MAX), θ_JA. The maximum allowable power dissipation at any ambient temperature is
P_D = (T_J(MAX) – T_A)/ θ_JA. All numbers apply for packages soldered directly onto a PC Board.
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