TLK3101_16 Datasheet, PDF (19/28 Pages) Texas Instruments – 2.5 Gbps to 3.125 Gbps TRANSCEIVER

TLK3101
2.5 Gbps to 3.125 Gbps TRANSCEIVER
SCAS649B − AUGUST 2000 − REVISED JANUARY 2008
thermal characteristics
R_θJA
R_θJC
PARAMETER
Junction-to-free-air
thermal resistance
Junction-to-case thermal
resistance
TEST CONDITION
Board-mounted, no air flow, high conductivity TI recommended test
board, chip soldered or greased to thermal land
Board-mounted, no air flow, high conductivity TI recommended test
board with thermal land but no solder or grease thermal connection to
thermal land
Board-mounted, no air flow, JEDEC test board
Board-mounted, no air flow, high conductivity TI recommended test
board, chip soldered or greased to thermal land
Board-mounted, no air flow, high conductivity TI recommended test
board with thermal land but no solder or grease thermal connection to
thermal land
Board-mounted, no air flow, JEDEC test board
MIN TYP MAX UNIT
21.47
42.20
°C/W
75.83
0.38
0.38
°C/W
7.8
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