TLK3101_16 Datasheet, PDF (14/28 Pages) Texas Instruments – 2.5 Gbps to 3.125 Gbps TRANSCEIVER

TLK3101
2.5 Gbps to 3.125 Gbps TRANSCEIVER
SCAS649B − AUGUST 2000 − REVISED JANUARY 2008
Terminal Functions (Continued)
power
TERMINAL
NAME
NO.
TYPE
DESCRIPTION
V_DD
1, 9, Supply Digital logic power. Provides power for all digital circuitry and digital I/O buffers.
23, 38,
48
V_DDA
55, 57 Supply Analog power. VDDA provides a supply reference for the high-speed analog circuits, receiver and
transmitter
GNDA
52, 58, Ground Analog ground. GNDA provides a ground reference for the high-speed analog circuits, RX and TX.
61
GND
5, 13, Ground Digital logic ground. Provides a ground for the logic circuits and digital I/O buffers.
18, 28,
33, 43
absolute maximum ratings over operating free-air temperature (unless otherwise noted)^†
Supply voltage, V_DD (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 3 V
Voltage range at TXD, ENABLE, GTX_CLK, TX_EN, TX_ER, LOOPEN, PRBS_PASS . . . . . . . . −0.3 V to 4 V
Voltage range at any other terminal except above . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to V_DD + 0.3 V
Package power dissipation, P_D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Storage temperature, T_stg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Electrostatic discharge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . HBM:3 kV, CDM: 1.5 kV
Characterized free-air operating temperature range, T_A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† _{Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and}
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTE 1: All voltage values, except differential I/O bus voltages, are with respect to network ground.
DISSIPATION RATING TABLE
PACKAGE
RCP64^§
T_A ≤ 25°C
POWER RATING
5.25 W
OPERATING FACTOR^‡
ABOVE T_A = 25°C
46.58 mW/°C
T_A = 70°C
POWER RATING
2.89 W
RCP64^¶
3.17 W
23.70 mW/°C
1.74 W
RCP64^#
2.01 W
13.19 mW/°C
1.11 W
‡ _{This is the inverse of the traditional junction-to-ambient thermal resistance (RθJA).}
§ _{2 oz. Trace and copper pad with solder}
¶ _{2 oz. Trace and copper pad without solder}
# _{Standard JEDEC high-K board}
For more information, refer to TI application note PowerPAD Thermally Enhanced Package, TI
literature number SLMA002
14
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