AM1802 Datasheet, PDF (174/180 Pages) Texas Instruments – AM1802 ARM Microprocessor

AM1802
SPRS710C – NOVEMBER 2010 – REVISED MARCH 2012
()
AM1802
( ) ZWT ( ) 3
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PREFIX
X = Experimental Device
P = Prototype Device
Blank = Production Device
DEVICE SPEED RANGE
3 = 300 MHz
TEMPERATURE RANGE (JUNCTION)
DEVICE
SILICON REVISION^(B)
B = Silicon Revision 2.0 or 2.1
D = -40°C to 90°C (Industrial Grade)
PACKAGE TYPE^(A)
ZCE = 361-Pin Plastic BGA, with Pb-free
Soldered Balls [Green]; 0.65-mm Ball Pitch
ZWT = 361-Pin Plastic BGA, with Pb-free
Soldered Balls [Green]; 0.80-mm Ball Pitch
A. BGA = Ball Grid Array
B. Parts marked revision B are silicon revision 2.1 if '21' is marked on the package and silicon revision 2.0 if there is no
'21' marking.
Figure 6-1. Device Nomenclature
6.2 Documentation Support
The following documents describe the device. Copies of these documents are available on the Internet at
www.ti.com. Tip: Enter the literature number in the search box provided at www.ti.com.
Reference Guides
SPRUGX5 AM1802 ARM Microprocessor System Reference Guide. Describes the AM1802 ARM
microprocessor (MPU) system.
SPRUFU0 AM17x/AM18x ARM Microprocessor Peripherals Overview Reference Guide. Provides
an overview and briefly describes the peripherals available on the AM17x/AM18x ARM
Microprocessors.
6.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the
respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views;
see TI's Terms of Use.
TI E2E Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and
help solve problems with fellow engineers.
TI Embedded Processors Wiki Texas Instruments Embedded Processors Wiki. Established to help
developers get started with Embedded Processors from Texas Instruments and to foster
innovation and growth of general knowledge about the hardware and software surrounding
these devices.
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