TLK2711JRZQE Datasheet, PDF (17/27 Pages) Texas Instruments – 1.6 TO 2.7 GBPS TRANSCEIVER

TLK2711
1.6 TO 2.7 GBPS TRANSCEIVER
THERMAL INFORMATION
thermal characteristics
R_θJA
R_θJC
PARAMETER
TEST CONDITION
Board-mounted, no air flow, high conductivity TI recommended test
board, chip soldered or greased to thermal land
Junction-to-free-air
thermal resistance
Board-mounted, no air flow, high conductivity TI recommended test
board with thermal land but no solder or grease thermal connection to
thermal land
Board-mounted, no air flow, JEDEC test board
Board-mounted, no air flow, high conductivity TI recommended test
board, chip soldered or greased to thermal land
Junction-to-case thermal Board-mounted, no air flow, high conductivity TI recommended test
resistance
board with thermal land but no solder or grease thermal connection to
thermal land
Board-mounted, no air flow, JEDEC test board
SLLS501 – SEPTEMBER 2001
MIN TYP MAX UNIT
21.47
42.20
°C/W
75.88
0.38
0.38
°C/W
7.8
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